Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability design and cost. In electronic systems packaging materials may serve as electrical conductors or insulators create structure and form provide thermal paths and protect the circuits from environmental factors such as moisture contamination hostile chemicals and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical thermal thermomechanical mechanical chemical and miscellaneous properties as well as their significance in electronic packaging. . Language: English