Welcome to our shop! Features: - Good moisturizing, bright and full solder joint, little smoke, no irritating smell. - Less residual, high insulation resistance, high activity, strong welding force. - Easy to weld, can protect BGA traces from corrosion and moisture. - Good wetting, dry resistance, long shelf life at room temperature. - Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc. Specification: - Viscosity: 200 (Pa. S) - Granularity: 24-45 (um) - Product size: 37 * 20mm / 1.5 * 0.8in - Alloy components: Sn63 - Activity: high activity - Melting point: 183℃ - Temperature: 220~380℃ Package List: - 1 x Solder Paste 100% Satisfaction: Our customers are our top priority. If you find any product problems after receiving the goods, such as damage and incorrect quantity of goods, please contact the seller immediately. We try our best to provide you with satisfactory after-sales service.