1 Introduction. - 1. 1 Capacitor Fundamentals. - 1. 2 Application Domains. - 1. 3 Physical Structures/Embodiments. - 1. 4 Capacitor Integration Drivers. - 1. 5 Thin-Film Capacitor Technology. - 1. 6 Summary. - 1. 7 References. - 2 Design Fundamentals. - 2. 1 Breakdown Voltage and Capacitance Density Design Limits. - 2. 2 Tolerance in Capacitance Density. - 2. 3 DC Leakage. - 2. 4 Capacitor Losses. - 2. 5 Series Inductance and Resistance. - 2. 6 References. - 3 Performance Detractors. - 3. 1 Interfacial Micro-roughness. - 3. 2 Deviation from Optimal Stoichiometry. - 3. 3 Film Microstructure. - 3. 4 References. - 4 Electrical Characterization. - 4. 1 Thin Film Decoupling Capacitors. - 4. 2 Characterization Methodologies. - 4. 3 Test Vehicle: Design and Fabrication. - 4. 4 Dielectric Constant and Loss. - 4. 5 Total Series Inductance. - 4. 6 Leakage Current Density. - 4. 7 Capacitance Density and Breakdown Field. - 4. 8 Summary and Conclusion. - 4. 9 References. - 5 Integration Issues and Challenges. - 5. 1 Metal Diffusion into Dielectrics. - 5. 2 Interlayer Stresses and Adhesion. - 5. 3 Low Thermal Budget. - 5. 4 References. - 6 Applications. - 6. 1 2D Interconnections in ICs. - 6. 2 Integration into 2D Packaging. - 6. 3 Flex Circuits. - 6. 4 Large Area Power Distribution. - 6. 5 Integration into 3D Structures. - 6. 6 Electromagnetic Considerations. - 6. 7 Power Electronics. - 6. 8 References. Language: English